湖北基依自动化有限公司（广州办事处）业代理德Voigt electronic GmbH PCB 电路板
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：vestsa
产品系列： Your boards are assembled on state-of-the-art, high-precision and highly flexible pick-and-place machines. Full convection reflow soldering is the soldering process most frequently used in the electronics production line. For soldering in the SMD production line Voigt electronic uses a reflow soldering system from Rehm Thermal Systems. The THT assembly takes place on state-of-the-art ergometric workstations. Continuous ESD protection is just as much a matter of course as the use of the latest manual soldering equipment from ERSA. Programming and interlocking can be used to ensure that optimum parameters are always applied, even in the case of manual soldering. For the soldering that takes place after the THT assembly two wave-soldering systems from Kirsten Soldering AG. are used. The patented jet wave of the soldering systems guarantees the flawless and gentle processing of subassemblies with a maximum width of 400 mm. Selective soldering is a process used for the firm bonding of components and PCBs. In contrast to wave soldering, the power and the soldering aids are provided locally. This facilitates the subsequent soldering of THT components on pure reflow assemblies, the soldering of PCBs with THT components mounted on both sides, and the gentle processing of temperature-sensitive components. To repair multipolar SMD components or BGAs and Quad Flat No-Lead （QFN） packages, we use an ERSA repair workstation which enables defective components to be automatically unsoldered with the aid of a control program and new switching circuits to be placed. The monitoring of the top side of the components and the temperature of the PCBs ensures a controlled process. In order to protect subassemblies against damage or malfunctioning caused by damp or deposits, more and more users are beginning to provide their subassemblies with a protective coating of paint. Subassemblies which have to function reliably under particularly critical environmental influences can be subjected to changing storage temperatures after they come off the production line.SMD assembly
The annual maintenance of our systems guarantees a constant level of accuracy across the entire component spectrum from the chip size 0201 to the BGAs with an edge length of 50 x 50 mm. The assembly rate is max. ca 35,000 units per hour. It should also be noted that the entire spectrum of state-of-the-art components can be assembled, e.g. BGAs, µBGAs, CSPs, QFNs or QFPs.
Full convection reflow soldering
The use of forced convection for circulating airflow guarantees optimum process security. The temperature-stability is +/- 1K. Both air and nitrogen can be used as a transport medium for the thermal energy.
Naturally our systems are also suited for higher temperatures in the processing of lead-free solders and have sufficient reserve capacity for boards with high thermal requirements.
THT assembly
Wave soldering
The negative pressure generated by the flow of the solder is exerted in a gentle but constant manner on the components on the top side of the PCBs. Thus they remain in position and do not rise up, as is usually the case with other systems using Wörthmann or double wave. Perfect results with special masks are also achieved with selective soldering processes – both with leaded and unleaded solders.
Selective soldering
The process used is selective soldering with the point shaft. This involves moving the solder pot with the point shaft under the subassembly to be soldered. The conventional components are soldered under nitrogen atmosphere. The advantages for you are reproducible soldering joints, compley soldered PCBs, and subassemblies that have been manufactured under the right technological conditions.
Repair workstation
Painting of subassemblies
Voigt electronic paints subassemblies compley or selectively by means of an NC spray valve with a programmable spray range of 350 x 450 mm. If the thickness of the paint or the coat of paint under components has to meet more exacting requirements, we can offer a selective dipping method.
Simulating the environment by changing storage temperatures （burn-in）
Here the climatic chamber has a volume of 240 l. Depending on the test run the temperatures can be varied between -40 and 180° C. The climatic chamber also has a cable duct to enable external measuring devices to be connected. In addition, all readings can be archived.
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