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￥面议
铜
铜是一种软质，有延展性的材料，具有导电及导热性能。其优秀的导电性能多用于散热器，交换器、配电组件及汽车母线的生产制造，也可用于点焊柄、射频通信的天线生产。Markforged Metal X完成铜材料测试打印，用户通过3D打印可以降低生产成本、加速生产周期，井可提高产品的几何性能。
Composition | Amount |
Copper | 99.8% min |
Oxygen | 0.05% max |
Iron | 0.05% max |
Other |
bal |
Typical Mechanical Properties Standard Temp Markforged As-Sintered MIM Standard
Ultimate Tensile Strength |
| Room Temp | 193 MPa1 | 207 MPa |
0.2% Tensile Yield Strength | ASTME8 | Room Temp | 26 MPa1 | 69 MPa |
Elongation at Break | ASTM E8 | Room Temp | 45%' | 30% |
Relative Density | ASTM B923 | Room Temp | 98%2 | Composition |
Electrical Conductivity | ASTM E1004 | Room Temp | 84%IAC$3 | — |
Thermal Conductivity | ASTM E1461 | Room Temp | 350W/mK4 | 328 W/mK |
Coefficient of Thermal Expansion | ASTM E831-195 | 68-lOO^F | 9.6x10-6/^ | 8.7xlO-6/°F |
ASTM E228 | 68-150°F | 9.7xlO-6/*F | 8.9 x 10-6/°F | |
68-200.F | 9.8xlO-6/°F | 9.1xlO-6/*F | ||
68-250°F | 9.9X10-6/T | 9.3xlQ6/°F | ||
68-300°F | 10.0 x 10-6/T | 9.4xlO-6/°F | ||
68-501TF | 10.1 x 10-6/T | — | ||
68・750.F | 10.5X10-6/T | — |
