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MSA-600显微激光测振仪

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  • 公司名称宝力达光学科技(东莞)有限公司
  • 品       牌
  • 型       号
  • 所  在  地东莞市
  • 厂商性质其他
  • 更新时间2023/4/2 21:16:35
  • 访问次数408
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宝力达光学科技有限公司是一家专注于光学测量系统解决方案的高科技公司。 公司自成立以来,坚持秉承“聚焦光学、创造价值”的经营理念,凭借专业的技术和不断创新的精神为用户提供优秀的解决方案。 作为的光学测量系统方案提供商,我们自主研发非接触式激光测振系统,运用激光多普勒技术帮助用户深入理解结构力学性能,解决结构的安全性、可靠性问题;结合自动化技术帮助用户实现产品质量的全面管控,解决产品的生产制造、问题。 经过10多年的技术沉淀,我们专长于感知、解析和行动 – 实现测量数据的采集、分析和有效利用 – 为用户提供实现生产速度和生产力加速的自信,并提升产品品质。 科学研究和制造业的进步,离不开*的测量技术和专业服务,我们的目标是为用户提供更加*的测量系统和更加专业的增值服务。
MSA-600显微激光测振仪 基于MEMS系统的一体化光学测量解决方案基于MEMS系统的MSA-600显微式激光测振仪,集多种测量功能于一体,其不仅能测量面内振动和面外振动,还能测量表面形貌。系统具有的灵活性和精度,以满足显微结构未来的发展需要。显微式激光测振仪可提供精确的三维动态和静态响应数据,在降低开发和制造成本的同时提高产品性能,从而缩短设计周期,简化故障处理,提高产品产量......
MSA-600显微激光测振仪 产品信息
The Micro System Analyzer is the premier measurement tool for  the analysis and visualization of structural vibrations and surface  topography in micro structures such as MEMS. By fully integrating a  microscope with scanning laser doppler vibrometry, stroboscopic video microscopy and scanning white light  interferometry, the Micro System Analyzer is designed with an all-in-one  combination of technologies that clarifies real microstructural response and  topography.

    

SYSTEM:

Optical Unit

The MSA Optical Unit is offered in six configurations that allow individual  or combined in-plane measurements, out-of-plane measurements or topography  measurements. Depending on system type, the optical unit comprises the head with microscope optics as well as a single-point or differential fiber optic interferometer. In all  configurations, the Sensor Head has optimized microscope optics, an  integrated LED illumination unit and a progressive scan video camera which  provides a live video stream for the Data Management System.

Processing Unit  

The Processing Unit comprises the Data Management System with MSA  Software, the Junction Box and, in system configurations that  include vibrometry, the Vibrometer Controller.



Software

The Software comprises the different programs for data acquisition and  evaluation:
•Scanning Vibrometer software for out-of-plane measurements  offers quick and easy set up, simple data acquisition and outstanding 3D  data visualization.
•Planar Motion Analysis software similarly controls the in-plane  measurement process and provides a dynamic visualization.
•Topography Measurement System Software for data acquisition,  analysis, 2D and 3D data representation, including profile cuts.


Configurations

The Micro System Analyzer can be configured to cover many operating  modes and measurement ranges needed to characterize microstructures. The  following table helps to match the appropriate system to the application.   we provides systems for either single-task or combined measurements. For  out-of-plane vibration measurements, the system can be configured for either  single-beam or differential operation. Differential systems can perform both  single-beam and differential measurements. In addition to the standard 1.5  MHz version, there is a 24 MHz option that features both high-frequency data  acquisition and a high-frequency waveform generator.



 

FEATURES:

Award-Winning Micro System Analyzer

Incorporated in the MEMS design and test cycle, we provides  precise 3D dynamic and static response data that simplifies troubleshooting,  enhances and shortens design cycles, improves yield and performance, and  reduces product cost. This outstanding degree of innovation has been  recognized by two prestigious awards: the 2005 Sensor Innovation Award and  the Photonics Circle of Excellence for the development of microscope-based  scanning vibrometry.


Superior Dynamic Characterization Compared to Single Technology Solutions

The combination of two complementary measurement techniques for  investigating the vibrational behavior of small structures provides superior  performance. For example, it can quickly identify, visualize and measure  system resonances and transient responses, enhancing overall measurement  productivity. This improved efficiency is especially important when  integrating the measurement system into automated processes for MEMS  production environments. Single-technology solutions like ESPI, white light  interferometry, and phase-shifting interferometry give a much more limited  view of small structure response.



Finds All Mechanical Resonances Without Prior Information

Using wide-band excitation, the highly sensitive laser-Doppler technique  can rapidly find all mechanical resonances (in-plane and out-of-plane)  without prior information. In a second step, stroboscopic video microscopy is  used to obtain accurate amplitude and phase information of in-plane  resonances identified through laser vibrometry.

BENEFITS:


The All-in-One Solution - Superior Integration  of Technologies
•Rapid identification and visualization of both system resonances and  static topography
•Integrated microscope optics with optimized optical path for best lateral  resolution and highest image quality
•Easy integration with MEMS/wafer probe stations
•Simple and intuitive operation, ready to measure within minutes
•Increased productivity through short measurement cycle
•Accelerates product development, troubleshooting and time-to-market



Scanning Laser-Doppler Vibrometry for the  Measurement of Out-of-Plane Vibrations
•Full-field vibration mapping and broadband, out-of-plane frequency  response information
•Displays frequency-domain and time-domain data, simplifying transient  response analysis
•High-density sample grids with up to 512 x 512 user-defined measurement  points
•Versatile data import and export interfaces to validate FE models
•Submicron laser spot for measuring very small structures and details
•Laser dimmer for optimized measurement conditions


Stroboscopic Video Microscopy for In-Plane Motion Detection
•Stroboscopic video measurement of in-plane motion with frequencies up to 1  MHz
•Time-domain displacement measurements with nanometer resolution
•Integrated signal generator for step-response, ring-down and Bode plot  measurements
•Time-saving, automatic multiband processing


White Light Interferometry for the Acquisition of Topography Data
•Rapid, non-contact 3D topography measurement with subnanometer resolution
•Determination of structure heights and shape on both rough and specular  surfaces
•Overlay technique copes with different contrast levels and material mixes
•Powerful TMS software for topography and surface characterization

•2D and 3D presentation with video overlay




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