ST-D-UVL紫外激光打标机
ST-D-UVL Laser Marking Machine
产品特点
■属于冷激光,特别适合于微加工
■整机风冷却方式
■新型半导体激光源,电光转换效率高,使用寿命长
■三阶腔内倍频技术,光斑极小,基本没有加工热影响
●New semiconductor laser source , high electricity-laser exchange ratio, long using lifetime
●Third-order intracavity frequency doubling technology , tiny spot, basically no heat affected processing
●Low power consuming, maintenance free, stable performance
技术参数 Technical parameter
输出功率 Laser power 2W/3W/5W/7W
激光波长 Wavelength 355nm
光束质量 Beam quality ㎡<1.3
标刻范围 Marking scope 65×65/110×110/160×160mm(可选 optional)
标刻速度 Marking speed ≤7000mm/s
最小线宽 Min. line width 0.01mm
最小字符 Min. Character 0. 1mm
脉 宽 Pulse width 20ns(20KHz)
脉冲能量 Pulse energy 150uj(20KHz)
脉冲重要频率 Repeat precision 10-200KHz
供电电源 Power supply 220V±10% 50Hz/12A
整体功耗 Power consumption 400W
工作温度 Working temperature 5℃--35℃
适用材料 Applicable Materials
电器材料、包装材料、玻璃材料的冷加工
Cold machining of electric materials, packaging materials and glass materials
适用领域 Applicable Industry
医药、食品、低压电器、LED晶元、触摸屏ITO膜、塑料等行业
Medicine, food, low voltage electric appliance, LEO wafer,touch screen ITO film, plastic and so on
ST-D-UVL Laser Marking Machine
产品特点
■属于冷激光,特别适合于微加工
■整机风冷却方式
■新型半导体激光源,电光转换效率高,使用寿命长
■三阶腔内倍频技术,光斑极小,基本没有加工热影响
■整机能耗低,免维护
●Cold laser, particularly suitable for micromachining
●Air cooling●New semiconductor laser source , high electricity-laser exchange ratio, long using lifetime
●Third-order intracavity frequency doubling technology , tiny spot, basically no heat affected processing
●Low power consuming, maintenance free, stable performance
技术参数 Technical parameter
输出功率 Laser power 2W/3W/5W/7W
激光波长 Wavelength 355nm
光束质量 Beam quality ㎡<1.3
标刻范围 Marking scope 65×65/110×110/160×160mm(可选 optional)
标刻速度 Marking speed ≤7000mm/s
最小线宽 Min. line width 0.01mm
最小字符 Min. Character 0. 1mm
脉 宽 Pulse width 20ns(20KHz)
脉冲能量 Pulse energy 150uj(20KHz)
脉冲重要频率 Repeat precision 10-200KHz
供电电源 Power supply 220V±10% 50Hz/12A
整体功耗 Power consumption 400W
工作温度 Working temperature 5℃--35℃
适用材料 Applicable Materials
电器材料、包装材料、玻璃材料的冷加工
Cold machining of electric materials, packaging materials and glass materials
适用领域 Applicable Industry
医药、食品、低压电器、LED晶元、触摸屏ITO膜、塑料等行业
Medicine, food, low voltage electric appliance, LEO wafer,touch screen ITO film, plastic and so on