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深圳才纳半导体设备有限公司
深圳才纳半导体设备有限公司
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才纳RFID标签全自动封装机RFM-2000是一款倒装式电子标签封装设备，使用各向异性导电胶热压固化封装，卷带式送料，自动拾放芯片，自动封装与收卷，精密的压力控制系统，确保压力控制稳定，提高产品的良品率，它是集光、机、电、气、液于一体的高精技术设备，适合于LF、HF、UHF等不同频段与规格电子标签的封装。 设备尺寸 ......
Operation
Bonding Principle | Chip fed by fixture or tray and Substrate fed by reel to reel. Automatic Dispensing, chip loading, chip attachment and bonding. Chip fed by fixture or tray and Substrate fed by reel to reel. Automatic Dispensing, chip loading, chip attachment and bonding. | Antenna dimension Chip Dimension | Antenna: ≤100mm×60mm
Chip:0.4mm×0.4mm～2mm×2mm |
Vision System | PR System | Dimiation | 1200mm*500mm*1200mm |
Additional function | inline functional test | Weight | 260 kg |
substrate Material | PET PVC PAPER | Electrical Power | 500 W |
adhesive | ACA NCA ICA | Air Power | 5bar≤P≤7bar |
Productivity | 700—800 pcs/hr | Bonding Force | 50—500g |
Attach Accuracy | ±20 μm | Bonding Temperature | 50—300 ℃ |
Automatic RFIDInlay Assembly System (Compact) RFM-1200
RF-2000 is ancompact RFID inlay system used to attach and fix RFID chip to substrate withantenna, and suit for LF, HF, UHF RFID label assembly.
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